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Properties Density g/cm3 Flexural modulus MPa Tensile strength MPa Water Absorption* % Specifications Grade Name H series G362 H(+) 1.43 9500 200 3.5 PPA, 30%GF, low moisture absorption, high stiffness, excellence thermal and ethyleneglycol resistance G382 H(+) 1.53 11500 235 3.5 PPA, 40%GF, low moisture absorption, high stiffness, excellence thermal and ethyleneglycol resistance G3A2 H(+) 1.64 15000 255 3.0 PPA, 50%GF, low moisture absorption, high stiffness, excellence thermal and ethyleneglycol resistance, replaces metal G3C2 H(+) 1.77 18000 260 3.0 PPA, 60%GF, low moisture absorption, high stiffness, excellence thermal and ethyleneglycol resistance, replaces metal A series G352 A(+)WT 1.60 7700 100 3.5 PA66/PPA. 25%GF, good stiffness, low moisture absorption, high reflective for LEDs G362 A(+) 1.40 9000 190 5.0 PA66/PPA. 30%GF, good stiffness, low moisture absorption G382 A(+) 1.50 10500 225 3.5 PA66/PPA. 40%GF, good stiffness, low moisture absorption G3A2 A(+) 1.61 14500 250 3.5 PA66/PPA. 50%GF, good stiffness, low moisture absorption G3C2 A(+) 1.73 17500 260 3.0 PA66/PPA. 60%GF, good stiffness, low moisture absorption M series G362 M(+) 1.37 8500 185 5.0 PA66/PPA, 30%GF, high stiffness and dimensional stability G382 M(+) 1.47 10500 230 4.5 PA66/PPA, 40%GF, high stiffness and dimensional stability G3A2 M(+) 1.57 14000 245 4.0 PA66/PPA, 50%GF, high stiffness and dimensional stability, low warpage G3C2 M(+) 1.69 16500 255 3.5 PA66/PPA, 60%GF, high stiffness and dimensional stability, low warpage AN4920SN FWB50 1.60 14000 230 4.0 PA66/PPA, 50%GF, high stiffness and dimensional stability (+)：Represents English or numeric characters for displaying color or specification differences. * According to ISO 62（23°C /Saturated） HPPA Composites Flame Retardant High Performance Nylon Composite Engineering Plastic Description Characteristics： Excellent electrical and mechanical properties Excellent flame retardant properties, UL94 certification Excellent high temperature characteristics, some Specifications heat distortion temperature >280°C and UL94 V0 grade, applicable to lead-free (SMT) process requirements Molding conditions： Drying conditions：80~130°C，time：2~4 hours Injection temperature：280~320°C Mold temperature：100~150°C